SiC grinding and polishing
When processing SiC substrates there is frequently a need to thin down the wafer and this is sometimes combined with a request for a specific surface structure. SiC is a very hard material and therefore these process steps are more demanding than for other semiconductors. Norstel has developed special processes to handle these tough challenges. We would be pleased to process your substrates.
Do you have SiC substrates, SiC epitaxial layers or GaN-on-SiC substrates that you would like to have fully characterized but you do not have the measurement tools available? We have an extensive set of characterization tools so please send us your inquiry.
For further product information please contact us by e-mail at email@example.comSIC-epitaxy and other services